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    BEGO’s latest 3D printer shown at IDS 2017

    The Varseo S allows for a larger build and accepts open STL files.

    At this year’s IDS in Cologne, Germany, BEGO was attracting crowds with its newest developments, including the newest edition of the Varseo 3D printer, the Varseo S, which now allows for an open STL file.

    The Varseo S building plate is about 30 percent larger than the previous model, enabling it to print more objects simultaneously. Despite expansion of the building plate, the housing is quite a bit smaller—about 40 percent smaller, in fact.

    Aside from allowing open STL files, the Varseo S also ensures a safer process. “The device can recognize if you’re using the wrong material, which is important for ensuring a safe process,” says Andreas Röthig, Key Account Manager for BEGO. “If it’s the wrong material, you can read on the display that it’s the wrong material for the data file.”

    The Varseo S also includes a new light-curing unit: the BEGO Otoflash. Otoflash will quickly and reliably cure the VarseoWax resins. Users of the Varseo S will also be happy to know that BEGO’s printing systems are in compliance with the MDR.

    Related: Read about the original Varseo 3D printer

    Also on display at IDS were new materials in the VarseoWax spectrum, including the VarseoWax Splint E for 3D printing of occlusal splints. Digital Esthetics learned on the show floor that BEGO will soon be providing VarseoWax Base for 3D printing full denture bases and VarseoWax Temp for 3D printing long-term temporaries.

    Crowds were also drawn by the BEGO LabScan UHD powered by exocad, which features two rotating 4.0 MP cameras with ultra high definition quality, and the BEGO SPEEDSCAN/3Shape scanner, which features two high-definition 5.0 MP cameras.

    BEGO also used the IDS floor to highlight the expansion of their CAD/CAM materials, including the Mediloy cobalt-chrome and titanium milling blanks, the Wirobond C+ for orthodontic appliances, the KATANA Zirconia UTML and the BEGO PMMA Splint E.  

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